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Digital Twin Concept in Copper Electroplating Process Performance

07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.
PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.

Sharp Launches A2 Size ePoster Color Electronic Paper Display

06/19/2025 | JCN Newswire
Sharp Corporation announces the launch of the A2 size ePoster color electronic paper display, which maintains its display with zero watts (0W) power consumption once images are set.

IPC Issues Call for Participation for IPC APEX EXPO 2026

06/02/2025 | IPC
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026. 

Training AI Together—Without Sharing Private Data

05/21/2025 | Nolan Johnson, SMT007 Magazine
Artificial intelligence models work better with more data. While individual EMS companies can certainly create plenty of data over time, the broader the data set, the more insightful the AI results can be. Ben Rachinger, a research assistant at Friedrich-Alexander-Universität Erlangen-Nürnberg, received the NextGen Best Paper at IPC APEX EXPO 2025. His research asks: What if a model could be created that allowed industry-wide data in the model, while still protecting proprietary information?

Real Time With... IPC APEX EXPO 2025: Best Student Technical Paper Winner—Attila Rektor

04/10/2025 | Marcy LaRont, I-Connect007
Attila Rektor, a Ph.D student from Boise State, won the best technical paper award at IPC APEX EXPO 2025. His paper explores enhancing the conductivity of laser-induced graphene for flexible circuits. The research, funded by SAIC, involved modulating surface energy to enable effective copper plating. This breakthrough has potential applications in flexible printed circuit boards, sensing, and biomedical devices.
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