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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
February 25, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle.
NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
In “Semi-Flex Design Guidelines,” the team addresses applications that require limited bending without the added cost and complexity of fully flexible circuits. The paper explains how designers can select thin rigid FR-4 materials to enable controlled bending during installation, while emphasizing that semi-flex designs are best suited for static or limited-bend applications. Key considerations include minimum bend radius, copper distribution in bend areas, layer symmetry, and the use of flexible solder mask or coverlay to reduce mechanical stress.
NCAB extends its design-for-manufacturing approach in “Ultra HDI Design Guidelines,” which tackles the challenges of shrinking geometries and increasingly dense interconnect structures. The paper outlines practical design rules for microvias, pad sizes, dielectric thicknesses, and stackups that support both manufacturability and electrical performance as designs move beyond traditional HDI limits.
In “Stackups and Impedance Design Guidelines,” the focus is on the structural foundations that support signal integrity. This paper explains how symmetrical stackups, controlled dielectric spacing, and consistent copper weights help designers meet impedance targets while minimizing warpage in high-speed and high-frequency applications.
In “Multilayer Design Guidelines,” the authors address copper balance, via strategies, and drilling tolerances. These fundamentals help designers achieve stable manufacturing outcomes as board complexity and layer counts continue to increase.
Together, NCAB Group’s white papers reflect a design-for-manufacturing mindset. By translating fabrication constraints into actionable design guidance, the authors help engineers improve reliability, reduce rework, and achieve more predictable results.
Visit the I-Connect007 Industry Resource Center to explore these resources—and many more—designed to strengthen your PCB design strategy.
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Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRETeradyne, Inc., a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry.
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.