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'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
May 2, 2025 | TopLineEstimated reading time: Less than a minute

Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly. On May 6, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will present “Braided Solder Columns for Cold Electronics - Moon, Mars and Beyond” at the SPACE PARTS WORKING GROUP (SPWG) 2025, an international forum in El Segundo, California, to disseminate information to the aerospace industry and to resolve problems with high-reliability electronic piece parts needed for space and missile applications. In-person attendance will be held at The Aerospace Corporation, 210 S. Douglas Street, El Segundo, CA 90245.
“Braided Solder Columns are non-collapsible, robust and compliant structures used for reducing stress caused by CTE mismatch,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.”
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See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
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E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.