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Global Electronics Association Expands Free Member Training Library with New Safety and Ergonomics Courses

04/23/2026 | Global Electronics Association
The Global Electronics Association today announced three new complimentary courses in safety and ergonomics, expanding its member training library to help manufacturers onboard workers faster and improve production performance.

Fineline Global to Exhibit at PCB East 2026, Showcasing Global PCB Solutions for North American Market

04/23/2026 | Fineline Global
Fineline Global, a leading global provider of advanced printed circuit board (PCB) solutions, today announced that it will be exhibiting at PCB East 2026 on Wednesday, April 29 at the DCU Convention Center in Worcester, Massachusetts.

India’s Vasantha Advanced Systems: EMS Success for 30 Years

04/22/2026 | Marcy LaRont, I-Connect007
Based in one of India’s premier manufacturing regions, Vasantha Advanced Systems is an EMS provider that has built a reputation for quality, reliability, and long-term customer partnerships, earning repeated recognition from the Indian government through its National MSME Awards. Now, with a full spectrum of capabilities spanning PCB assembly, box build, and wire harness, and a workforce of more than 500, Vasantha is expanding its presence into the U.S. market. At APEX EXPO, I met Dr. Chidambaranathan and learned how this rising global player is positioning itself to meet the evolving needs of North American customers.

New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains

04/22/2026 | I-Connect007 Editorial Team
A new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.

EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates

04/21/2026 | Alison James and Chris Mitchell, Global Electronics Association
The European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks
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