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Cyient Announces the Launch of Semiconductor Subsidiary
April 8, 2025 | PRNewswireEstimated reading time: 2 minutes
Cyient, a leading global engineering and technology solutions company, announced the launch of its fully owned semiconductor subsidiary, Cyient Semiconductors. This strategic move strengthens the company's commitment to innovation and excellence across the global semiconductor landscape.
By carrying forward Cyient's expertise in semiconductor design, Cyient Semiconductors will focus on scaling Application-Specific Integrated Circuit (ASIC) turnkey solutions for customers. For more than 25+ years, Cyient has been delivering comprehensive ASIC turnkey solutions and semiconductor design services across industrial, data center applications, automotive, and medical. Driven by strategic organic and inorganic growth, Cyient Semiconductors has built high-performance teams across India, the U.S., Germany, Belgium, the Netherlands, and Taiwan.
"Our vision is to align Cyient's semiconductor capabilities with the national agenda set by the Ministry of Electronics and Information Technology, aiming to build a robust semiconductor ecosystem in India. With the growing demand for high-performance semiconductor solutions, Cyient Semiconductors will play a crucial role in providing end-to-end ASIC turnkey and IC design services, supporting India's journey toward self-reliance in the semiconductor ecosystem," said Krishna Bodanapu, Executive Vice Chairman & Managing Director, Cyient.
"I am also happy to share that we have appointed Suman Narayan as the CEO of Cyient Semiconductors. Suman is an accomplished professional in the semiconductor space with a proven track record of managing large organizations, scaling semiconductor businesses, and driving digital transformation. His expertise in semiconductor products and ASIC development will be instrumental in shaping the future of Cyient Semiconductors," he added.
The semiconductor market is valued at approximately $600 billion and is projected to reach $2 trillion by 2032. The new subsidiary will tap into this high-growth opportunity, focusing on developing fabless semiconductor solutions while addressing the increasing demand for specialized semiconductor expertise.
"India is on the cusp of a semiconductor revolution, and Cyient is well-positioned to be at the forefront of this transformation," said Suman Narayan, CEO of Cyient Semiconductors.
"With our deep domain expertise, we will continue to empower global and domestic clients with high-value solutions. We firmly believe that the new semiconductor subsidiary will drive next-generation innovations meeting the requirements of our customers," he added.
Cyient's strong IP portfolio, deep domain expertise, long-standing customer partnerships, and global capabilities will give Cyient Semiconductors the strategic edge to achieve significant growth.
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More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
Intel Foundry Push Gains Momentum With Apple as Potential Customer
05/13/2026 | I-Connect007 Editorial TeamApple’s reported decision to tap Intel as a manufacturing partner for future chips could mark one of the most significant shifts in the semiconductor supply chain in years, with implications that extend well beyond consumer electronics.
SEMI: Global Semiconductor Materials Market Revenue Reaches Record $73.2 Billion in 2025
05/13/2026 | SEMIGlobal semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported in its Materials Market Data Subscription (MMDS).
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.