Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
Fresh PCB Concepts: More Than Compliance—A Human-centered Sustainability Approach
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
April 2, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Jonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement. Nordson is expanding globally to improve support and is exploring AI innovations to meet future demands for higher yield and intelligent machinery.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S
07/11/2025 | Nordson Test & InspectionNordson Test & Inspection today announced that smartTec will expand distribution of X-Ray and Test Solutions to include Denmark, Norway, Finland, Sweden, Latvia, Lithuania and Estonia.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Nordson Appoints Chase Collier as a Regional Sales Manager for the EDI Product Line
06/11/2025 | Nordson CorporationNordson Corporation, through its Polymer Processing Systems division, has announced the appointment of Chase Collier as a regional sales manager. In this role, Collier will focus on building and maintaining relationships with customers in the United States while providing exceptional technical sales support and service to processors and OEMs.