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2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue

04/29/2025 | SEMI
Global semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported in its Materials Market Data Subscription (MMDS).

New RF Materials Offer Options for RF Designers

04/29/2025 | Andy Shaughnessy, Design007 Magazine
The RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.

Real Time with... IPC APEX EXPO 2025: Winner of the IPC Best Student Poster Award

04/29/2025 | Real Time with...IPC APEX EXPO
Sebastian Carrillo, winner of the Best Student Technical Poster Award, shares insights on his research in nanotechnology and plasmonics. His work on a metal insulator nano array focuses on light-matter interactions at the nanoscale. With advancements in manufacturing, applications include sensing technologies and photovoltaic systems. Sebastian discusses his project involving simulations and optical experiments. His career goals are in research, and he encourages students to seize academic opportunities.

New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability

04/29/2025 | IPC
IPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.

Rising Star Award: Paavo Niskala, TactoTek

04/28/2025 | Nolan Johnson, I-Connect007
Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
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