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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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Design007 Magazine March 2025: Learning to Speak 'Fab'
March 10, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

When we started planning this issue, we couldn’t help comparing PCB designers and fabricators to citizens of different countries trying to communicate. They can each comprehend most of what the other person is saying, but a lot of the little things are lost in translation. And here again, it’s the little things that can cause big misunderstandings.
In the March 2025 issue of Design007 Magazine, our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. But as we see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Suggested Items
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
Designing Through the Noise: April 2025 Design007 Magazine
04/08/2025 | I-Connect007 Editorial TeamIn the April 2025 issue of Design007 Magazine, our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Hitachi Announces Completion of New Production Facility for Semiconductor Manufacturing Equipment
04/01/2025 | JCN NewswireHitachi High-Tech Corporation announced that the new production facility for semiconductormanufacturing equipment (etch systems), which had been under construction since December 2023 in the Kasado area (Kudamatsu City, Yamaguchi Prefecture), was completed and started the operation on March 17, 2025.