Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
Renesas, Altium Announce Introduction of Renesas 365, Powered by Altium
March 7, 2025 | BUSINESS WIREEstimated reading time: 3 minutes
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Altium, a global leader in electronics design software, proudly announce the introduction of Renesas 365, Powered by Altium, a first-of-its-kind industry solution designed to streamline electronics system development from silicon selection to system lifecycle management. This transformative solution will be demonstrated at embedded world, Booth 5-371, March 11-13, in Nuremberg, Germany, and is expected to be available in early 2026.
This introduction marks a pivotal moment following Renesas’ acquisition of Altium, underscoring the transformative potential of their combined expertise. Built on the Altium 365 platform, Renesas 365, Powered by Altium, eliminates inefficiencies, connects teams, enables solution discovery, and ensures digital continuity—accelerating development and empowering engineers to build better, smarter products.
Pioneering the Future of Electronics Systems Innovation
Renesas 365 will tackle longstanding industry challenges. Embedded system development often suffers from manual component searches, fragmented documentation, and siloed teams. Renesas 365 addresses these challenges by connecting Altium’s advanced cloud platform with Renesas’ comprehensive embedded compute, analog & connectivity, and power portfolio. By integrating hardware, software, and lifecycle data into a single digital environment, it will streamline workflows, accelerate time to market, ensure digital traceability and real-time insights, and improve decision-making from concept to deployment.
“The introduction of Renesas 365 is a major milestone toward Renesas’ Digitalization vision. We envision making electronics design accessible to broader market to allow more innovation by creating an Electronics System Design and Lifecycle Management platform together with Altium,” said Hidetoshi Shibata, CEO of Renesas. “Renesas' expertise in embedded semiconductor solutions and Altium’s leadership in electronics design and collaboration will enable a first-of-its-kind solution. Renesas 365 transforms how intelligent, connected electronic systems are designed, developed, and sustained.”
Five Integrated Pillars
Renesas 365 is built on five interconnected solution pillars, ensuring seamless system-level integration and continuous digital context throughout the product lifecycle:
- Silicon – Serving as the foundation for modern electronic solutions, Renesas 365 ensures that every silicon component is application-ready and optimized for software-defined products. Whether for ultra-low-power IoT devices or demanding AI-driven applications, Renesas 365 delivers silicon that seamlessly integrates with the broader system.
- Discover – Powered by Altium, Discover enables engineers to find not just components but complete solutions from Renesas’ comprehensive portfolio for faster and more accurate system design.
- Develop – Powered by Altium, Develop provides a multidisciplinary cloud-based development environment, ensuring real-time collaboration across hardware, software, and mechanical teams.
- Lifecycle – Powered by Altium, Lifecycle establishes persistent digital traceability, enabling seamless over-the-air (OTA) updates and ensuring compliance and security from concept to deployment.
- Software – Provides AI-ready development tools to ensure software-defined systems are optimized for modern applications.
Addressing the Next Generation of Electronics
Renesas 365 is designed for the next generation of electronics innovation, aligning with emerging industry trends by providing a unified software framework for software-defined systems spanning low- to high-compute performance; AI-ready development tools that enable real-time, low-power AI inference at the edge; and advanced security, compliance tracking, and automated OTA updates to ensure secure lifecycle management.
Setting a New Industry Standard: Connecting Silicon to Systems
Renesas 365 is more than a technological advancement—it is the next step in the digital transformation of electronics, bridging the gap between silicon and system development. By ensuring seamless collaboration, real-time decision-making, and persistent system context, Renesas and Altium will redefine how electronics systems are designed, developed, and sustained—from silicon selection to full system realization—in a connected world.
Experience the Power of Renesas 365 at embedded world
At embedded world, Renesas will bring Renesas 365 to life with a dynamic live demo, showcasing its power as a unified industry solution for modern electronics development. This seamless, cloud-connected platform enables engineers to move effortlessly from concept to prototype to fleet management.
Attendees will experience firsthand how Renesas 365 streamlines the design process, from silicon selection to embedded software development to Edge AI and over-the-air updates. The platform’s seamless integration ensures that existing workflows remain uninterrupted, supporting everything from custom AI models to advanced RTOS implementations like PX5 RTOS, helping to bridge the software gap between MCU and MPU worlds.
Share on:
Suggested Items
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.
IPC APEX EXPO 2025 Review: The New Normal Looks Like the Old Normal
04/16/2025 | Nolan Johnson, SMT007 MagazineAt IPC APEX EXPO, my days are filled with either talking or listening from sunup to sundown. I get to answer questions of some of the brightest minds in the business, while also listening and synthesizing what they’re sharing with me about the current and future state of the industry. Here are five observations based on the conversations.
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.