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Draper Breaks Ground on New Microelectronics Building in Lowell

10/14/2026 | Draper Laboratory
Draper recently held a groundbreaking ceremony for a new microelectronics building in Lowell, Massachusetts. The building will house Draper's Integrated Microelectronics Production & Advanced Chip Technology (IMPACT) Center.  

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LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

I-Connect007 Welcomes Michael Gleason as New Columnist

10/14/2026 | I-Connect007
I-Connect007 welcomes Michael Gleason, director of product development and strategic growth at GreenSource Fabrication, as its newest columnist. His monthly column, Built for What’s Next, will appear in I-Connect007 Magazine, offering a forward-looking perspective on PCB design, advanced manufacturing, and the technologies shaping the next generation of electronics. With more than 20 years of experience in PCB manufacturing, Gleason brings a combination of engineering expertise, operational leadership, and practical knowledge of advanced fabrication.

Qnity Expands Thermal Management Solutions for AI Memory Cooling

10/13/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced two new advanced memory cooling solutions leveraging Laird™ Graphite-over-Foam (GOF) and Laird™ Thermal Interface Material (TIM) technologies.
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