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Design007 Magazine March 2025: Learning to Speak 'Fab'

03/10/2025 | I-Connect007 Editorial Team
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders in the March 2025 issue of Design007 Magazine. But as you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/07/2025 | Andy Shaughnessy, I-Connect007
It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?

Recruiting the Next Generation of PCB Designers at Garmin

03/06/2025 | Andy Shaughnessy, I-Connect007
Laura Beth (LB) Yates, PCB design engineering manager at Garmin, discusses the company's innovative approach to recruiting the next generation of PCB designers. As she points out, the best part of her job is “going to work every day with my friends and making cool stuff.”

Target Condition: ‘Boomer to Zoomer: Do You Copy?’

03/04/2025 | Kelly Dack -- Column: Target Condition
Let’s just admit it. The baby boomer PCB designers are looking at retirement, but it’s been a good run. In the 1980s, many of us still “taped out” our PCB artwork layers and then drove them over to the graphic art service to be photo-reduced onto film positives and negatives. Then, almost overnight, the PCB design industry changed.

Discover the New Podcast Series on Thermal Management—Now Available

03/05/2025 | I-Connect007
In this premiere podcast episode, Ryan Miller of NCAB breaks down why thermal management is a must for PCB designers. What are the main causes of excess heat in our designs today? Why does it matter? And how can designers keep their boards cool under pressure?
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