-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Dan Beeker on the Design Engineer of the Future
February 7, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

As technical director at NXP Semiconductors, Dan Beeker specializes in EMC and signal integrity design techniques. He’s known for his field-based design classes; you may remember the cover of Meghan Trainor’s “All About That Bass” that Dan and his daughter Breezy released in 2015 titled “All About The Space.” Check it out on YouTube; it’s funny, and it definitely gets the point across.
As we begin 2025, I contacted Dan to get his thoughts about the design engineers of the future. What will their jobs look like?
Andy Shaughnessy: Dan, how will the typical PCB design engineer’s job evolve over the next five to 10 years?
Dan Beeker: The challenges will be driven by the changes in technology. Smaller IC geometries for transistors and packages and increased power supply requirements make the basic functional design more challenging. Evolving standards for reduced allowable radiated emission levels and increased levels of immunity will impact compliance.
A solid understanding of the underlying science of electromagnetic physics will be more critical than ever. Improvements in the design tool space may help, but until the tools are dielectric-aware and can manage the entire three-dimensional structure of the electronic control system, they will only provide false hope. Careful empirical evaluation of each design will still be the primary method for designing good PCBs.
To read this entire conversation, which appeared in the January 2025 issue of Design007 Magazine, click here.
Suggested Items
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
05/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024.
KYZEN’s Adam Klett to Present at 2025 SMTA Electronics in Harsh Environments Conference
05/05/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that Director of Science Adam Klett, PhD will present during the technical conference at the 2025 SMTA Electronics in Harsh Environments Conference.
Airbus Reports Q1 2025 Results
05/05/2025 | AirbusConsolidated revenues increased 6% year-on-year to € 13.5 billion (Q1 2024: € 12.8 billion). A total of 136 commercial aircraft were delivered (Q1 2024: 142 aircraft), comprising 17 A220s, 106 A320 Family, 4 A330s and 9 A350s.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.