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Visteon, Qualcomm Redefine Next-Generation AI-based Intelligent Cockpit Experience

04/28/2025 | PRNewswire
At Auto Shanghai 2025, Visteon Corporation, a global leader in automotive cockpit electronics, and leading automotive technology company, Qualcomm Technologies, Inc., announced a technology collaboration to bring groundbreaking capabilities to the automotive industry with Visteon's new high-performance cockpit system, powered by Visteon's automotive artificial intelligence (AI) framework, cognitoAI, and Qualcomm Technologies Snapdragon® Cockpit Elite Platform.

Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation

04/25/2025 | Siemens
Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

04/24/2025 | PRNewswire
Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,

Koh Young Installs 24,000th Inspection System at Fabrinet Chonburi

04/23/2025 | Koh Young
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at Fabrinet Chonburi in Thailand. This advanced facility is operated by Fabrinet Co., Ltd., a global provider of advanced manufacturing services, specializing in complex optical, electro-optical, and electronic products

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

04/23/2025 | BUSINESS WIRE
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, bolsters its leadership in foundational AI silicon connectivity subsystems through silicon proven chiplets and IP subsystems on advanced process nodes and package types. This is set to be showcased at the TSMC 2025 North America Technology Symposium.
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