The Future of Electronics Manufacturing in APAC
January 30, 2025 | Daniel Schmidt, MKS' ATOTECHEstimated reading time: 1 minute

The Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
Transforming Electronics Manufacturing
The electronics industry's shift to 3D heterogeneous integration—assembling chips on organic substrates—is driving demand for new materials, processes, and technologies. This innovation, combined with the industry's increasing presence in APAC, leverages the region's robust manufacturing capabilities and investment opportunities, positioning it for substantial growth.
Meeting the Challenges of Advanced Technologies
The rise of AI, renewable energy systems, and autonomous vehicles has created a demand for components that are faster, smaller, and capable of handling immense data loads. Essential for miniaturization and high-speed applications, next-generation technologies using electrochemical deposition for advanced semiconductor packaging, semi-additive processing (SAP) for package substrates, or modified SAP (mSAP) at the printed circuit board level enable the much finer feature sizes required for increased density and fast signaling. In addition, advanced materials such as glass substrates are contributing to this trend, enabling finer feature sizes with improved signal integrity, which is critical for high-performance systems.
Read the rest of this article in the January 2025 issue of PCB007 Magazine.
Suggested Items
Visteon, Qualcomm Redefine Next-Generation AI-based Intelligent Cockpit Experience
04/28/2025 | PRNewswireAt Auto Shanghai 2025, Visteon Corporation, a global leader in automotive cockpit electronics, and leading automotive technology company, Qualcomm Technologies, Inc., announced a technology collaboration to bring groundbreaking capabilities to the automotive industry with Visteon's new high-performance cockpit system, powered by Visteon's automotive artificial intelligence (AI) framework, cognitoAI, and Qualcomm Technologies Snapdragon® Cockpit Elite Platform.
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Koh Young Installs 24,000th Inspection System at Fabrinet Chonburi
04/23/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at Fabrinet Chonburi in Thailand. This advanced facility is operated by Fabrinet Co., Ltd., a global provider of advanced manufacturing services, specializing in complex optical, electro-optical, and electronic products
Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
04/23/2025 | BUSINESS WIREAlphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, bolsters its leadership in foundational AI silicon connectivity subsystems through silicon proven chiplets and IP subsystems on advanced process nodes and package types. This is set to be showcased at the TSMC 2025 North America Technology Symposium.