Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

KKR Launches Helix Digital Infrastructure, a New Company to Finance and Deliver the Next Generation of AI Infrastructure

06/11/2026 | BUSINESS WIRE
KKR, together with the Kuwait Investment Authority (KIA), NVIDIA (NASDAQ: NVDA) and Vistra (NYSE: VST) today announced the launch of Helix Digital Infrastructure (“Helix”), a new company designed to deliver integrated infrastructure at the speed and scale required for hyperscalers to meet accelerating artificial intelligence (AI) demand.

Qnity Launches Optivision Max CMP Pad Family for Next-Gen Semiconductor Manufacturing

06/10/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads.

Mobix Labs to Acquire U.S.-Built Drone Manufacturer Vision Aerial

06/05/2026 | BUSINESS WIRE
Mobix Labs, Inc. announced that it has signed a binding Letter of Intent to acquire Vision Aerial, Inc., a Montana-based manufacturer of American-built drones trusted in national security, government, energy, public safety, and critical infrastructure operations.

DIMAAG Acquires Akridata to Scale Physical AI and Next-Generation Infrastructure

05/28/2026 | BUSINESS WIRE
DIMAAG, a deep technology company building industrial AI, energy systems, and high-performance infrastructure for hyperscale AI data centers, announced the acquisition of Akridata, a company specializing in AI vision systems and edge-to-core AI infrastructure.

Three Key Takeaways on Material Management From Cogiscan’s Latest White Papers

05/27/2026 | I-Connect007 Editorial Team
Effective material management has become increasingly critical as PCB assembly operations face mounting pressure to improve efficiency, control costs, and maintain quality in complex manufacturing environments. To help electronics manufacturers navigate these challenges, Cogiscan has contributed two complementary white papers to the I-Connect007 Industry Resource Center, offering practical strategies for improving material visibility, traceability, and production performance.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in