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PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032
January 17, 2025 | EINPresswire.comEstimated reading time: Less than a minute
The global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years. The market is expected to reach US$75.26 billion in 2024 and grow further to USD 100.0 billion by 2032, representing a compound annual growth rate (CAGR) of 3.62% during the forecast period (2025-2032). The consistent demand for electronics and advancements in technology are the primary drivers for the PCB market.
Key Drivers of Market Growth
1. Technological Advancements: The rapid development of new technologies, such as 5G, artificial intelligence (AI), and the Internet of Things (IoT), is boosting the demand for advanced PCBs.
2. Rising Demand in Consumer Electronics: The proliferation of smartphones, wearables, and home appliances is fueling PCB market growth.
3. Growth in Automotive Electronics: Increasing integration of electronic components in vehicles, such as infotainment systems, safety systems, and electric vehicle (EV) components, is driving PCB demand.
4. Industrial Automation: The adoption of robotics and automation in industries requires advanced PCBs, contributing to market expansion.
5. Global Shift Toward Renewable Energy: The need for PCBs in solar panels and wind turbines is expected to rise as renewable energy becomes more widespread.
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
Teledyne FLIR Defense to Deliver Portable Chemical Detectors to US Customs and Border Protection
10/21/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has received an order from U.S. Customs and Border Protection (CBP) for 15 of its Griffin™ G510x portable chemical detectors, specifically designed to analyze and identify explosives and narcotics, such as fentanyl and nitazenes, within five minutes.
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Designers Notebook: Power and Ground Distribution Basics
                                         Designers Notebook: Power and Ground Distribution Basics Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
                                         Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics Beyond Design: The Fundamental Structure of Spectral Integrity
                                         Beyond Design: The Fundamental Structure of Spectral Integrity





 
                     
                 
                    