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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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January 2025 Issue of Design007 Magazine: The Designer of the Future
January 13, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The Designer of the Future
As we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what the PCB designers of 1975 would think about the typical PCB designer’s workday. What will the designers' job be like in the future?
In the January 2025 issue of Design007 Magazine, our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Suggested Items
Connect the Dots: Proactive Controlled Impedance
05/29/2025 | Matt Stevenson -- Column: Connect the DotsFrom data centers to smartphones, designers know that the ohms have it. Getting impedance right ensures all-important signal integrity and delivers high-performing boards. Our designers understand the importance of controlled impedance, but not everyone addresses it in their designs. The most common and important controlled impedance types we see include microstrip, stripline, embedded microstrip, and differential pairs.
Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
05/27/2025 | Polar InstrumentsPolar's latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025. More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.
Material Selection and RF Design
04/21/2025 | Andy Shaughnessy, Design007 MagazineInnovation rarely sleeps in this industry, and the RF laminate segment offers a perfect example. RF materials have continued to evolve, providing PCB designers much more than an either/or choice. I asked materials expert Alun Morgan, technology ambassador for the Ventec International Group, to walk us through the available RF material sets and how smart material selection can ease the burden on RF designers and design engineers.