Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.

Spirit Announces Sale of FMI to Tex Tech Industries

01/14/2025 | Spirit AeroSystems Holdings, Inc.
Spirit AeroSystems Holdings, Inc. announced the sale of Fiber Materials Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex Tech Industries, Inc. (Tex-Tech) for $165 million in cash.

Imec Achieves Breakthrough in Silicon Photonics

01/13/2025 | Imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.

SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025

01/08/2025 | SolderKing Assembly Materials Ltd,
SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.

SMTA Announces Wafer-Level Packaging Symposium Program

01/08/2025 | SMTA
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in