Dana on Data: The Missing AI-NPI Link
Beyond Design: Key SI Considerations for High-speed PCB Design
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
IPC Releases Latest List of Standards and Revisions
December 17, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to the IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive.
IPC/Hermes-9852-v1.6
The Global Standards for Machine-to-Machine Communication in SMT Assembly
IPC-Hermes-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-Hermes-9852 can assist any electronics manufacturer, large or small, to align their companies with Smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities for Hermes-enabled equipment to be queried on its Hermes capabilities.
To see the rest of the standards released for Q4, which were featured in the Fall 2024 issue of IPC Community, click here.
Share on:
Suggested Items
Four Industry Leaders Receive IPC President’s Award at IPC APEX EXPO 2025
03/21/2025 | IPCIn recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, four IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, California, on March 18, 2025.
Compal Launches New High-Performance GPU Server Platforms at GTC 2025
03/20/2025 | PRNewswireAt GTC 2025, Compal Electronics unveiled three new server platforms—SX420-2A, SX220-1N, and SX224-2A. All are built on NVIDIA MGX architecture and designed to inject powerful performance into enterprise-level AI, HPC, and high-load computing applications.
NextFlex Launches $5M Funding Opportunity to Strengthen US Electronics Industrial Base
03/20/2025 | PRNewswireNextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing.
TRI at SMTA Monterrey 2025
03/19/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will be participating in the SMTA Monterrey Expo & Tech Forum 2025 at the Cintermex Convention Center on April 10, 2025.
Technica USA Appoints Jason Perry as New President
03/19/2025 | Technica USATechnica USA, a leading provider of materials, equipment, and services for the printed circuit board (PCB) fabrication, assembly, MEMS, and semiconductor industries, is pleased to announce the appointment of Jason Perry as its new President.