-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
December 13, 2024 | ROHMEstimated reading time: 1 minute
ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.
ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.
For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.
Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.
Suggested Items
Huawei Single SitePower Solution Creates Four Synergies to Accelerate Site Intelligence
05/27/2025 | PRNewswireDuring the 9th Global ICT Energy Efficiency Summit in Dubai, Huawei showcased its next-generation digital and intelligent site power facility solution Single SitePower, which is set to drive the intelligent transformation of ICT energy infrastructure.
Honeywell Expands Defense Modernization Efforts in Japan with New Aerospace Technologies
05/26/2025 | HoneywellHoneywell announced the expansion of its support for Japan’s defense modernization efforts with the delivery of advanced aerospace systems for two key helicopter programs. These latest awards expand Honeywell’s footprint in Japan’s defense sector and reinforce the company’s commitment to mission readiness and long-term operational performance.
TI Teams with NVIDIA to Bring Efficient Power Distribution to AI Infrastructure
05/26/2025 | Texas InstrumentsTexas Instruments technologies will help enable NVIDIA's future 800V high-voltage DC power-distribution systems for next-generation AI data centers.
Qualcomm, Xiaomi Expand Collaboration with Multi-Year Agreement
05/23/2025 | Qualcomm Technologies, Inc.Qualcomm Technologies, Inc. and Xiaomi Corporation are celebrating 15 years of collaboration and have executed a multi-year agreement.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.