-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
HANZA Acquires Leden
December 13, 2024 | HANZAEstimated reading time: 2 minutes
HANZA AB has signed an agreement to acquire Leden Group, a leading Finnish company in advanced mechanics manufacturing with a turnover of approximately SEK 1,1 billion. The acqusition strengthens HANZA's manufacturing cluster and is an important step in the HANZA 2025 strategy.
Leden Group is a contract manufacturer in sheet metal, machining and complex assembly with four production sites in Finland and one in Estonia. The business also includes import, processing and selling of sheet metal and manufacturing of own steel profiles. The company has a strong market position with a diversified customer base from industries such as power management, medical technology, IT infrastructure and industrial automation.
With this acquisition, HANZA is expanding its offering in Finland in particular, but also in the Baltics. Among other things, this means increased capacity and expertise in advanced mechanics manufacturing.
Summary of the transaction
- The acquisition includes 100% of the shares in Leden Group Oy.
- The purchase price is based on a multiple of 7 for the EBITA outcome 2025 on a cash and debt-free basis. The purchase price consists of a combination of cash and new shares in HANZA, which gives the sellers the opportunity to participate in HANZA's future value development.
- At closing, a purchase price is paid consisting of:
- A cash portion of EUR 21 million
- 2,300,000 issued shares in HANZA, valued at EUR 14 million, approximately SEK 70 per share. This corresponds to a dilution of approximately 5%.
- The purchase price may increase by a maximum of EUR 15 million, dependent on Leden’s earnings development during 2025. The share portion may also increase by 300,000 shares, dependent on HANZA’s share price development in 2025.
- All issued shares in HANZA are subject to lock-up clauses.
- The cash portion of the purchase price is fully financed through credit facilities and existing cash.
- The maximum purchase price corresponds to an EV/EBITA multiple of 7 or less on a cash and debt-free basis.
Management comments
"The acquisition of Leden is an important step in achieving our goals under our strategy, HANZA 2025", says Erik Stenfors, CEO HANZA. "With Ledens strong market position and technological expertise, we are significantly strengthening our offer."
”We look forward to being an important part of HANZA”, says Jukka Haapalainen, CEO Leden. ”We share the same values and see great opportunities for even faster profitable growth thanks to HANZAs unique concept in contract manufacturing.”
About the future
The acquisition is expected to be concluded in the first quarter of 2025, following regulatory approvals.
The acquisition is an important part of HANZAs operational plan HANZA 2025.
HANZA reiterates its financial targets for 2025, including SEK 6.5 billion in sales and an operating margin of 8%.
Suggested Items
TRI Test Solutions at INNOELECTRO 2025
04/02/2025 | TRIAnytest will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase TRI's Test Solution.
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Do You Have X-ray Vision? SMT007 Magazine April Issue Is No Joke
04/01/2025 | I-Connect007 Editorial TeamAs component packaging continues to evolve, the capability of inspecting through components is crucial. Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question—and others—to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: We’ve Got It Covered
04/01/2025 | I-Connect007 Editorial TeamIPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage.