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Real Time with... electronica 2024: ICAPE—Localized Manufacturing Strategies and Strategic Acquisitions
November 26, 2024 | Real Time with... electronicaEstimated reading time: Less than a minute
Pete Starkey interviews Christelle Bonnevie, chief industrial officer at ICAPE Group. Bonnevie summarizes the evolution of the group and the strategy of developing a network of manufacturing facilities outside Asia. She also discusses the recent acquisition of NTW in Japan and explains the mechanism of integrating it into the ICAPE organization. Click here to listen.
For more coverage from electronica 2024 or to visit our event photo gallery, click here.
Suggested Items
Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
11/25/2024 | Real Time with... electronicaIn this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.
Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
11/22/2024 | Real Time with... electronicaMarcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
11/14/2024 | Jerome Larez -- Column: Global PCB ConnectionsFlex printed circuit boards are an essential advancement in the electronics industry, enabling the development of flexible, lightweight, and durable electronic designs. As technology has evolved, long-flex PCBs have emerged as a key component in applications requiring extended or intricate routing paths. Because of their use in automotive, commercial, and medical devices, designers are becoming more comfortable designing PCBs with this technology. This column will explore their attributes and role in modern products. I will also offer some essential tips for designing with manufacturability in mind.