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Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations

02/21/2025 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.

North American PCB Industry Sales Up 19.9% in January

02/20/2025 | IPC
IPC announced today the January 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.

The Resurgence of European PCB Manufacturing: A Strategic Advantage

02/20/2025 | Jordan Labbe, ICAPE Group
The global electronics landscape is undergoing a significant transformation. Driven by a confluence of factors, including geopolitical instability, supply chain disruptions, and a growing emphasis on agility and localized production, a renewed focus on European PCB manufacturing is emerging. This resurgence is not merely a trend; it represents a strategic advantage for companies seeking to navigate the complexities of the modern electronics market with multiple sourcing options, outside of China.

Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?

02/19/2025 | Chrys Shea, SHEA Engineering Services
UHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago. 

EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability

02/19/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.
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