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Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
November 22, 2024 | Real Time with... electronicaEstimated reading time: Less than a minute
Marcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production. Click here to listen.
For more coverage from electronica 2024 or to visit our event photo gallery, click here.
Suggested Items
Imagineering, Accutrace Announce Strategic Merger to Enhance Service and Capabilities
01/17/2025 | Newswire.comImagineering Inc., a renowned PCB Fabricator and Assembler, is pleased to announce its merger with Accutrace Inc., a leader in providing time-critical, technologically advanced development and manufacturing services for the electronics industry.
PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032
01/17/2025 | EINPresswire.comThe global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years.
See You in Vienna: Speaker Spotlight on PEDC
01/16/2025 | I-Connect007 Editorial TeamVienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.
NAMICS Brings Innovative Thermoset Materials to PCB Fabrication
01/16/2025 | Andy Shaughnessy, Design007 MagazineAt PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.
AIM to Participate in SMTA Ultra High Density Interconnect Symposium
01/15/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona.