-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
U.S. Army Awards Lockheed Martin Contract to Increase PAC-3 MSE Production Capacity
November 14, 2024 | Lockheed MartinEstimated reading time: 1 minute
The U.S. Army recently awarded Lockheed Martin a contract to support increasing production capacity to 650 Patriot Advanced Capability – 3 (PAC-3®) Missile Segment Enhancements (MSEs)per year. This is a vital step in significant efforts to meet the global demand for the world’s most advanced missile.
“Demand for PAC-3 MSE’s combat-proven deterrence capabilities continues to grow at a rapid pace,” said Brian Kubik, vice president of PAC-3 Programs at Lockheed Martin Missiles and Fire Control. “To meet the increased demand, Lockheed Martin started this effort with internal funding more than a year ago to expand the PAC-3 MSE production capacity, both in our factories and across the supply chain. We are also investing to implement lean, agile processes to deliver this critical product to our partners more efficiently.”
Over the last eight months, the PAC-3 team has significantly increased output and achieved new record highs for missile production. In 2024, production has grown by more than 30% with another 20% growth planned for next year.
Lockheed Martin is on track to produce in excess of stated capacity for the next several years.By the end of 2024, Lockheed Martin will have exceeded 500 PAC-3 MSEs, a new production high. The team also recently completed the 2,000th PAC-3 MSE missile– a significant milestone in the life of the program.
The production ramp up of critical systems like PAC-3 is a key component of Lockheed Martin’s 21st Century Security® vision which aims to strengthen the defense industrial base and develop more advanced, modernized solutions. As Lockheed Martin continues to ramp up production to meet demand, PAC-3 MSE remains at the forefront, addressing both current and emerging threats with unwavering precision and effectiveness.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Muon Space Awarded $44.6M Space Force SBIR Phase III Other Transaction Authority (OTA) Agreement
10/13/2025 | Muon SpaceMuon Space, a leading provider of end-to-end space systems specializing in mission-optimized satellite constellations, announced it has been awarded a $44.6 million Small Business Innovation Research (SBIR) Firm Fixed Price Phase III Other Transaction Authority (OTA) Agreement from the United States Space Force’s Space Systems Command System Delta 810 (SYD 810).
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 |Ball grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.