-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
U.S. Army Awards Lockheed Martin Contract to Increase PAC-3 MSE Production Capacity
November 14, 2024 | Lockheed MartinEstimated reading time: 1 minute
The U.S. Army recently awarded Lockheed Martin a contract to support increasing production capacity to 650 Patriot Advanced Capability – 3 (PAC-3®) Missile Segment Enhancements (MSEs)per year. This is a vital step in significant efforts to meet the global demand for the world’s most advanced missile.
“Demand for PAC-3 MSE’s combat-proven deterrence capabilities continues to grow at a rapid pace,” said Brian Kubik, vice president of PAC-3 Programs at Lockheed Martin Missiles and Fire Control. “To meet the increased demand, Lockheed Martin started this effort with internal funding more than a year ago to expand the PAC-3 MSE production capacity, both in our factories and across the supply chain. We are also investing to implement lean, agile processes to deliver this critical product to our partners more efficiently.”
Over the last eight months, the PAC-3 team has significantly increased output and achieved new record highs for missile production. In 2024, production has grown by more than 30% with another 20% growth planned for next year.
Lockheed Martin is on track to produce in excess of stated capacity for the next several years.By the end of 2024, Lockheed Martin will have exceeded 500 PAC-3 MSEs, a new production high. The team also recently completed the 2,000th PAC-3 MSE missile– a significant milestone in the life of the program.
The production ramp up of critical systems like PAC-3 is a key component of Lockheed Martin’s 21st Century Security® vision which aims to strengthen the defense industrial base and develop more advanced, modernized solutions. As Lockheed Martin continues to ramp up production to meet demand, PAC-3 MSE remains at the forefront, addressing both current and emerging threats with unwavering precision and effectiveness.
Suggested Items
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
NAMICS Brings Innovative Thermoset Materials to PCB Fabrication
01/16/2025 | Andy Shaughnessy, Design007 MagazineAt PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.
Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation
01/14/2025 | Merlin Circuit TechnologyMerlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.
Global PCB Connections: The Future of HDI PCBs
01/16/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.