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SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium

11/26/2024 | SMTA
The SMTA is excited to announce the technical program for the 2nd annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.

NASA’s Europa Clipper: Millions of Miles Down, Instruments Deploying

11/26/2024 | NASA
Headed to Jupiter’s moon Europa, the spacecraft is operating without a hitch and will reach Mars in just three months for a gravity assist.

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab

11/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.

Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

Heilind Asia Pacific Awarded 2024 'Best Strategic Account Development' by TE Connectivity

11/25/2024 | GlobeNewswire
Heilind Asia Pacific is excited to share that it has received the 2024 Best Strategic Account Development Award from TE Connectivity, in recognition of the company's outstanding performance in driving business growth and strengthening strategic customer relationships.
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