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SIA Commends Selections for CHIPS R&D Flagship Facilities
November 4, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities. The first facility will focus on extreme ultraviolet (EUV) lithography research and will be located within NY CREATES’s Albany NanoTech Complex in New York. The second facility (Sunnyvale, CA) will serve as an administrative headquarters for the NSTC and host the Design Enablement Gateway. Together, these programs will advance semiconductor design, research, workforce development, investment, and collaboration for the U.S. semiconductor industry.
“This week’s announcements mark exciting milestones in the implementation of the critical R&D programs enacted in the bipartisan CHIPS and Science Act. EUV lithography research is an investment in American leadership at the leading edge. And, the Albany facility will democratize access to this extraordinary tool and enable NSTC research to commence in the next year, driving the mission to propel American chip innovation from day one.
“Natcast’s site in Sunnyvale, CA will establish a new hub at the heart of Silicon Valley for the next generation of R&D in chip design, electronic design automation (EDA), chip and system architecture, and hardware security. Moreover, the facility will advance core NSTC programs, including the Workforce Center of Excellence—building our industry’s most essential asset: an innovative and skilled workforce. We congratulate the Department of Commerce and Natcast for initiating these impactful programs and applaud their diligent efforts to continue driving American leadership in chips.”
These resources will be available to NSTC members and researchers. Natcast has opened NSTC membership and urges semiconductor companies, universities, nonprofits and research institutions, national labs, and government agencies to take part in shaping the future of U.S. semiconductor R&D leadership.
Suggested Items
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
American Made Advocacy: The Administration Changed, but Our Industry’s Needs Remain
11/26/2024 | Shane Whiteside -- Column: American Made AdvocacyThe beginning of the holiday season in Washington, D.C., this year also signals the changes that come with a new administration. Here are my projections about the effect on our industry. There will be a lot of noise in Washington when a new president occupies the White House and new members of Congress arrive on the scene. It is every member’s job to remind them all that “chips don’t float” and that there is more work to be done to create a secure and resilient supply chain for the microelectronics we depend on.
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.