Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Javelin Joint Venture Explores Production Opportunities in India

02/18/2025 | Lockheed Martin
The Javelin Joint Venture (JJV) is exploring future co-assembly and co-production opportunities of the Javelin anti-tank weapon system in India through a competitive source selection process with potential Indian partners.

3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.

02/04/2025 | PR Newswire
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

Marshall, AMMROC Forge Strategic Partnership to Explore Growth Opportunities

01/28/2025 | Marshall
Marshall and AMMROC, the UAE-based industry leader in aviation MRO services and integrated logistics support, announced the signing of a Memorandum of Understanding (MoU) to identify synergies and growth opportunities in the aerospace industry.

PFN, MC and IIJ to Establish Joint Venture Preferred Computing Infrastructure for AI Cloud Computing

12/27/2024 | Mitsubishi Corporation
Preferred Networks, Inc. (PFN), Mitsubishi Corporation (MC) and Internet Initiative Japan Inc. (IIJ) announced that the three companies will establish their joint venture Preferred Computing Infrastructure, Inc. (PFCI) on January, 2025.

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in