Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
Cicor Consolidates Thin-film Technology Business in Wangs
October 18, 2024 | CicorEstimated reading time: 1 minute
Cicor Group has decided to discontinue thin-film production at the Ulm site in Germany by the end of June 2025 and to concentrate production at the existing site in Wangs, Switzerland.
Reinhardt Microtech AG, founded in 1984 and based in Wangs, acquired the thin-film technology business in Ulm in 1998 and has been operating it as Reinhardt Microtech GmbH since then. The company has been part of the Cicor Group since 2007 and is part of the Advanced Substrates Division.
Cicor, the European market leader in the hybrid circuit business, is strengthening its activities by consolidating production at its site in Wangs, Switzerland. This will enable Cicor to reduce complexity, increase flexibility and strengthen risk management. Economic factors also indicate that it no longer makes sense to continue production in Ulm. From a technological point of view, Cicor's thin-film sites in Wangs and Ulm are capable to produce identical components. Reinhardt Microtech GmbH will continue to operate as a sales and competence center in the Ulm area, ensuring continued service to long-standing customers in the German market.
The employment relationships of the approximately 30 people affected by this decision will be terminated as of June 30, 2025. All employees will be offered the opportunity to relocate to the Wangs site or, in individual cases, to work in a sales role in the Ulm region.
The restructuring will have a six-digit CHF impact on Cicor Group's EBITDA in the current year and will lead to a significant improvement in the results of the business unit and the Advanced Substrates Division once the relocation is complete. The guidance for 2024 and the mid-term targets will not be affected by this measure.
Share on:
Suggested Items
Mark Schulman Rocks Zuken Innovation World + integrate24
04/10/2024 | ZukenZuken USA, Inc. is excited to announce that the renowned drummer and motivational speaker, Mark Schulman, will be the keynote speaker at this year's Zuken Innovation World Americas (ZIW) conference, co-located with integrate24. Scheduled for September 17-19, 2024, in the vibrant city of Cleveland, Ohio, the conference aims to bring together the brightest minds in the PCB, Wire Harness, and Digital Engineering fields.
ST Robotics Readies Engineering Students for Robotics Careers
12/03/2019 | ST RoboticsST Robotics software and hardware solutions are providing students with hands-on robotics training. Most recently, Rose-Hulman Institute of Technology purchased four more ST R12 industrial robots, for a total of 12 ST Robotics' five and six-axis industry-standard robots now being used in their college classrooms.
Henkel Expands BERGQUIST GAP PAD Portfolio
02/04/2019 | HenkelHenkel Corporation has announced the addition of two ultra-low modulus BERGQUIST GAP PAD thermal interface materials (TIMs) to its award-winning line of high compliance thermal management products.