-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Inside the New Facility at DIS
October 9, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 2 minutes
DIS has long been known as an equipment builder dedicated to PCB and assembly registration. Amidst a backdrop of increasing sales and expanding product lines, DIS has inaugurated a new facility and doubled its previous footprint. This move was aimed at enhancing operational efficiency and addressing space constraints that had plagued them for years, as well as allowing for the opportunity to expand their technology offering for their customers. In this candid conversation, Tony Faraci, owner and president of DIS, and Jesse Ziomek, DIS global sales director, delve into recent strategic advancements propelling the company forward.
Marcy LaRont: Tony, what led to the decision to build a new facility?
Tony Faraci: Over the past few years, we have been fortunate to see an increase in our sales. In the meantime, we've developed new product lines, and the machines have gotten bigger. Our original shop had serious space constraints, and I’d been looking to expand for a few years. We finally found the right facility, allowing us to double our space and set it up for the best possible workflow. As a result, we are significantly more efficient.
For instance, we have implemented better barcoding and traceability. When we get an order for a machine, for example, our engineering team releases a BOM to production. The BOM has a list of parts that go into the assembly bays. Every assembly bay has its own tools, and each one specializes in what is needed for that subassembly. Each subassembly is automatically assigned a barcode and goes into the queue for each bay as needed. At every machine bay, we can scan the barcode and, at any time, know every part we need, where things are in the procurement cycle, and where everything is in the shop. The new facility has made production much faster.
LaRont: Have you expanded or contracted your workforce due to the increased automation and efficiency?
Faraci: DIS has gotten bigger. We increased our head count in administration and IT, and added key people who monitor the process and the system. We tie purchasing into the subassemblies so we can schedule everything, allowing us to build and ship the machines on time. We’ve also added more tech support. As sales have increased, we need this additional tech support to be in the field, install the equipment, and provide application support. We have also increased our online application support. We can dial into the machines and talk to our customers anytime. Our guys are used to dialing into the machine at different times of the day to answer questions or help with an application. In addition to the new facility, these strategic staff additions are a significant investment for DIS. Providing superior technical service to our customers is one of our highest values.
Jesse Ziomek: Our equipment is in 23 countries, so it’s very important that we can extend critical and timely support to our customers everywhere that we do business.
To read the rest of this article, which appeared in the September 2024 issue of PCB007 Magazine, click here.
Suggested Items
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Airbus to Provide UK Ministry of Defence with Next-generation Satellite Modems for Skynet MILSATCOM
11/26/2024 | AirbusAirbus has signed a contract with the UK’s Ministry of Defence to provide the next-generation modems for the nation’s Skynet satellite communications constellation.
Plasmatreat Expands its International Network and Opens a Subsidiary in Mexico
11/26/2024 | PlasmatreatOn-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another branch in Querétaro, Mexico, to provide even better and more direct support to users and interested parties of atmospheric pressure plasma technology. Plasmatreat continues to expand its international network.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
HPC Customer Engages Sondrel for High End Chip Design
11/25/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.