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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/29/2026 | Michelle Te, I-Connect007
This week’s picks all seem to circle around one bigger reality: The electronics industry is rebuilding itself in real time. Whether it’s investing in workforce development, reshaping manufacturing processes, modernizing how we communicate with readers, or strengthening domestic advocacy, there’s a noticeable shift from simply reacting to challenges toward actively building long-term infrastructure.

Incap Slovakia Joins Slovak Security and Defence Industry Association

05/28/2026 | Incap
Incap Electronics Slovakia has joined the Slovak Security and Defence Industry Association (ZBOP), further strengthening Incap’s focus on electronics manufacturing for high-reliability and regulated industries, including the defence and security sector.

Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing

05/27/2026 | Carmichael Gugliotti, Director, MacDermid Alpha Electronics Solutions
The increasing power and complexity of electronics systems are intensifying the demands on printed circuit boards and IC substrates. Applications that include AI infrastructure, high-performance computing, electric vehicles, and next-generation consumer electronics require higher interconnect density and uncompromising reliability. At the same time, PCB fabricators are navigating a manufacturing environment shaped by supply chain volatility, sustainability mandates, and ongoing cost constraints.

KYZEN to Lead Professional Development Course on Cleanliness Measurement at SMTA STAR Forum 2026

05/26/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will present a professional development course, Fundamentals of Measuring Cleanliness, at the SMTA STAR Forum 2026, taking place July 15–16, 2026 at the Embassy Suites Kansas City Olathe.

KOKI to Highlight E-Series Zero Flux Residue Solder Paste at PCIM Europe 2026

05/22/2026 | KOKI
KOKI Company Ltd., a global leader in advanced soldering materials, will showcase its E-Series solder paste at PCIM Europe 2026 in Nuremberg, Germany, exhibiting in Hall 6, Booth 345, and bringing a focused solution to the evolving demands of power semiconductor manufacturing.
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