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KOKI Company Ltd., a global leader in advanced soldering materials, will showcase its E-Series solder paste at PCIM Europe 2026 in Nuremberg, Germany, exhibiting in Hall 6, Booth 345, and bringing a focused solution to the evolving demands of power semiconductor manufacturing.
As power devices such as IGBTs and MOSFETs continue to drive innovation in automotive, industrial, and energy applications, manufacturers are facing increasing pressure to improve reliability while reducing process complexity and cost. KOKI’s E-Series addresses these challenges with what is recognized as the industry’s first true zero flux residue solder paste platform.
Engineered specifically for power semiconductor applications, the E-Series eliminates the need for post-reflow cleaning by leaving virtually no flux residue. This is particularly important in processes such as wire bonding and molding, where even minimal contamination can impact yield and long-term device performance. By removing this variable, manufacturers can achieve greater process stability and confidence in downstream operations.
Beyond process simplification, the E-Series delivers measurable cost advantages. By replacing traditional solder preforms and conventional solder pastes, manufacturers can reduce both material usage and overall production costs by as much as 50% without compromising performance. The formulation is optimized for ultra-low voiding, supporting improved thermal management and enhanced reliability in high-power applications.
Available in multiple alloy compositions and powder sizes, the E-Series supports both stencil printing and dispensing processes, offering flexibility across a wide range of manufacturing environments.
“At PCIM, the conversation is centered around performance, efficiency, and reliability in power electronics,” said Johan Wallentin. “The E-Series was developed with those exact priorities in mind, helping manufacturers simplify their process while improving the performance of their devices.”
Visitors to PCIM Europe 2026 are invited to meet the KOKI team in Hall 6, Booth 345 to learn more about how the E-Series is redefining soldering performance for power semiconductor applications.
