-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Northrop Grumman to Produce First Hypersonic Glide Phase Interceptor
September 30, 2024 | Northrop GrummanEstimated reading time: 1 minute

The U.S. Missile Defense Agency (MDA) will proceed with Northrop Grumman Corporation for the Glide Phase Interceptor (GPI) program, the first-of-its-kind defensive countermeasure against hypersonic missile threats. Working in close partnership with MDA, the three-year developmental effort produced a purpose-built, innovative design capable of defeating existing and emerging hypersonic threats.
During this next phase of development, Northrop Grumman will:
- Continue to refine the preliminary design of the GPI, which will fire from the U.S. Navy’s Aegis Ballistic Missile Defense destroyers and Aegis Ashore using the standard Vertical Launch System
- Demonstrate system performance in hypersonic environments prior to conducting its Preliminary Design Review
- Complete flight experiments ahead of schedule leveraging the company’s own flight-proven systems
- Use digital engineering practices to connect the entire GPI program to accelerate design processes and develop interceptor capabilities faster and more efficiently
Expert:
Wendy Williams, vice president and general manager, launch and missile defense systems, Northrop Grumman: “GPI adds mission critical standoff to warfighters in scenarios where distance creates an advantage. Tailorable to a multitude of mission requirements, Northrop Grumman’s revolutionary solution is designed to perform in the evolving threat landscape.”
Details:
Northrop Grumman’s design includes advanced technologies, such as a seeker for threat tracking and hit-to-kill accuracy, a re-ignitable upper stage engine used for threat containment and a dual engagement mode to engage threats across a wide range of altitudes.
Northrop Grumman will work closely with the United States in support of its role under the GPI Cooperative Development program with the Japan Ministry of Defense to deliver interceptors to the MDA.
Suggested Items
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
indie Semiconductor Reports Q1 2025 Results
05/13/2025 | BUSINESS WIREindie Semiconductor, Inc., an automotive solutions innovator, today announced first quarter results for the period ended March 31, 2025. Q1 revenue was up 3.3 percent year-over-year to $54.1 million with Non-GAAP gross margin of 49.5 percent. On a GAAP basis, first quarter 2025 operating loss was $38.9 million compared to $49.6 million a year ago.
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
05/14/2025 | John Watson -- Column: Elementary, Mr. WatsonI've often been asked, "Can you have a perfect PCB design?" At first blush, it seems like the answer should be yes. After all, if you follow all the rules, double-check your work, and use the right tools, it should be perfect. Right?