-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
RTX's Raytheon Selected to Streamline Production of SPY-6 Transmit/Receive Modules
September 18, 2024 | PRNewswireEstimated reading time: 1 minute
Raytheon, an RTX business, has been awarded an Office of Naval Research (ONR) Navy ManTech project from Penn State University Applied Research Laboratory's Electronics Manufacturing Center of Excellence to streamline the production of SPY-6 Transmit/Receive (TR) modules. Manufacturing advancements like automation, new material sources and process yield improvements will result in cost-savings for the U.S. Navy across the life cycle of the SPY-6 radar.
"TR modules are a key component in many of the military's critical sensing systems," said Colin Whelan, president of Advanced Technology at Raytheon. "These manufacturing advancements will greatly benefit future capabilities and can be implemented on other U.S. Navy and Department of Defense programs."
SPY-6 is the U.S. Navy's family of radars that performs air and missile defense on several classes of ships. They enable ships to simultaneously detect, track, and discriminate air, surface and ballistic missile targets, providing a 360-degree integrated air and missile defense for ships.
The four variants of SPY-6 use common hardware and software, and their construction is modular – making it more reliable and less expensive to maintain. Manufacturing advancements will further increase performance while reducing overall production costs.
Work on this contract is being conducted in Andover, Massachusetts. New SPY-6 radio frequency TR modules are expected to be delivered in 2026-2027.
Suggested Items
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.