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Roke, Kaigai Expand Partnership to Deliver Cutting-Edge Electromagnetic Warfare and AI Surveillance to Japanese Defence Market

05/26/2025 | Roke
Roke, a UK company that stands at the forefront of defence and security, and Kaigai Corporation have announced an expansion of their strategic partnership, significantly increasing the availability of Roke’s cutting-edge products and services to the Japanese market. 

ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing

05/26/2025 | ClassOne Technology
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.

STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology

05/22/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in collaboration with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, announces the expansion of the “Lab-in-Fab” (LiF) in Singapore.

GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation

05/22/2025 | GlobalFoundries
GlobalFoundries (GF)  announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.

OKI Launches 124-Layer Circuit Board Technology

05/22/2025 | Andy Shaughnessy, Design007 Magazine
During PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.
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