-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ViTrox Showcases Cutting-Edge VisionXpert Smart Code Readers at SMTA Penang 2024
September 17, 2024 | ViTroxEstimated reading time: 1 minute
ViTrox, which aims to be the World’s Most Trusted Technology Company, is excited to announce its participation in the SMTA Penang at Table #37 in the AC Hotel, Penang on 25-26 September 2024.
ViTrox will showcase its core technologies that are driving the future of smart manufacturing. Our V310i Advanced 3D Solder Paste Inspection (SPI), V510i Advanced 3D Optical Inspection (AOI), V810i Advanced 3D X-ray Inspection (AXI), V9i Advanced Robotic Vision (ARV) and Industry 4.0 Manufacturing Intelligence Solutions (V-ONE) are now renowned for their ability to enhance inspection accuracy, efficiency and connectivity across production lines.
Our experts will be onsite to provide insights on these advanced PCB SMT inspection solutions. Visit our booth (Table #37) to meet with our experts on how our advanced technologies can optimise your production processes.
In addition, we are excited to showcase the VisionXpert Smart Code Reader (XS Series), designed to revolutionise the manufacturing process with its AI-driven capabilities. This innovative solution optimises code reading across various environments by excelling in decoding complex codes, deep learning and adaptive auto-tuning. These advanced features significantly enhance inspection accuracy and efficiency, minimising errors and maximising throughput, making VisionXpert an essential tool for ensuring the reliability of production lines.
Furthermore, we are also thrilled to announce that Mr. Calvin Anak Rigar, will be delivering a technical presentation titled ‘The Road to Manufacturing Process Self-Healing with A.I.’ at 2:00 PM on 26th September, delving into the evolution of Smart Manufacturing driven by Artificial Intelligence (A.I.). Attendees will gain insights into how automation in manufacturing has progressed beyond equipment-level processes and closed-loop Machine-to-Machine (M2M) communications. Through strategic architecture and environment planning, the implementation of AI can enable the creation of self-healing production lines that automatically optimise processes. Additionally, the conventional method of Statistical Process Control (SPC) data analysis can be automated and conducted in real-time, leading to more efficient process optimisation.
Suggested Items
Roke, Kaigai Expand Partnership to Deliver Cutting-Edge Electromagnetic Warfare and AI Surveillance to Japanese Defence Market
05/26/2025 | RokeRoke, a UK company that stands at the forefront of defence and security, and Kaigai Corporation have announced an expansion of their strategic partnership, significantly increasing the availability of Roke’s cutting-edge products and services to the Japanese market.
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
05/26/2025 | ClassOne TechnologyClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.
STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology
05/22/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in collaboration with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, announces the expansion of the “Lab-in-Fab” (LiF) in Singapore.
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
05/22/2025 | GlobalFoundriesGlobalFoundries (GF) announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.
OKI Launches 124-Layer Circuit Board Technology
05/22/2025 | Andy Shaughnessy, Design007 MagazineDuring PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.