Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.

SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress

01/16/2025 | SIA
The Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.

U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries

01/16/2025 | U.S. Department of Commerce
The U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.

Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem

01/13/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Honda, Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles

01/10/2025 | JCN Newswire
Honda Motor Co., Ltd. and Renesas Electronics Corporation announced that they have signed an agreement to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs).
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in