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Solder Printing: SMT007 Magazine—September 2024
September 3, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Solder Printing
One ubiquitous component in PCB assembly is solder paste. It’s what makes assembly happen. We can’t attach components without solder, and solder paste is a requirement for surface-mount components.
It hardly seems like there’s much room for innovation in something so common and basic. Yet, much is changing when it comes to applying solder paste: dispensing and jetting evolve right along traditional stencil printing techniques. Each is carving out their own niche of specialization on the manufacturing floor. Of course, the solder paste needs are changing to enable that evolution in print technologies as well.
Come along as we dive into the latest in solder printing in the September 2024 issue of SMT007 Magazine.
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Peters Leverages Inkjet Technology to Optimize PCB Manufacturing
01/17/2025 | PetersPeters has put the second SUSS LP50 ‘Pixdro’ inkjet printer into operation. This machine enables the application of solder resist in digital additive technology by means of the inkjet process, thus providing Peters Research, in this relatively new segment, with more possibilities in research and process technology, in addition to the conventional coating processes (screen printing, curtain coating and spray coating).
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Austin Expo & Tech Forum
01/16/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas.
Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025
01/16/2025 | Indium CorporationIndium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025
01/15/2025 | ELMOTECE-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.