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Latest Advancements in High-Reliability Electronics Focus of 2024 IPC High Reliability Forum
August 12, 2024 | IPCEstimated reading time: 1 minute
Ensuring reliability in high-voltage electronics, a new standardized test method for abrasion resistance of e-textiles, and assembly and solder joint X-ray challenges are just a few of technical conference topics offered at IPC’s High Reliability Forum, October 9-10 at the McKimmon Center in Raleigh, N.C.
Additional presentation topics cover: safety critical electronics considerations; military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements; and industry-curated content covering many different topics related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods.
Speakers from the following companies include Denis Barbini, Ph.D., Zestron; Steven Dirkes, U.S. Army; Ben Gumpert, Lockheed Martin; Norbert Holle, Ph.D., Robert Bosch GmbH; Takenori Kakutani, Taiyo Ink Manufacturing; Tony Lentz, FCT Assembly; Bob Neves, Microtek Laboratories & Reliability Assessment Solutions; Tim Pearson, Collins Aerospace; Erin Tillery, NC State University; and Udo Welzel, Ph.D., Robert Bosch GmbH.
“The event provides a unique opportunity for those in industry who design, manufacture, or test electronics for critical applications with unique safety, reliability, and lifetime requirements to obtain the latest research on high-reliability electronics,” said Teresa Rowe, IPC senior director, assembly and standards technology. “This year, attendees will learn about the newest research and emerging trends in high-reliability electronics, hear from subject matter experts, connect with exhibitors and peers, and take advantage of several networking opportunities during the course of the two-day forum.”
IPC High Reliability Forum will be co-located with IPC Builds which is being held October 5-10, 2024, at the McKimmon Center. IPC Builds focuses on IPC standards development committee meetings and encourages industry’s contribution to the standards and guidelines that companies and their customers, suppliers, and competitors rely on. Separate registration is required.
For more information on the IPC High Reliability Forum including agenda, speaker profiles, exhibition and sponsorship information, or to register for event, visit www.ipc.org/event/high-reliability-forum.
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Rachael Temple - AlltematedSuggested Items
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference
07/31/2025 | MAGNALYTIXMagnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects of Flux Residues and Process Contamination on the Reliability of the Electronic Assembly” on Wednesday, Aug. 13 at 9:00 AM CST to open the second day of the STMA High-Reliability Cleaning and Conformal Coating Conference.
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven
08/01/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation.
KYZEN Cleaning Experts to Provide Insights at SMTA High Reliability Cleaning and Coating Conference
07/29/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that three members of the KYZEN team of cleaning experts will present technical presentations as part of KYZEN’s participation at the 2025 SMTA High Reliability Cleaning and Conformal Coating Conference scheduled to take place Aug. 12-14, 2025 at the Westin DFW Airport.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.