-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ASMPT Makes High-strength and High-conductivity Joints Possible with Silver Sintering
July 30, 2024 | ASMPTEstimated reading time: 1 minute
ASMPT, the world’s leading provider of hardware and software for semiconductor and electronics production, presents an innovative die and module bonding platform that can be used in a variety of ways for producing power modules.
“Whether for electromobility, renewable energies or industrial automation and motor control systems – in the course of the energy transition, electricity is increasingly becoming the dominant energy source,” explains David Felicetti, Business Development & Product Marketing Manager, at ASMPT. “But especially in power electronics, conventional joining technologies such as soft soldering are increasingly reaching their limits.”
Silver sintering instead of soldering
ASMPT has overcome these limitations with its line of products for silver sintering and, in future applications, copper sintering. POWER VECTOR, for pick and place or tacking dies and modules on heat sinks, completes the process chain in ASMPT's sintering production line.
The advantages of this process are obvious: While silver has a melting point of 961 degrees Celsius, it can be “cemented” at much lower temperatures when pressure is applied, resulting is a thermally and mechanically strong connection with excellent conductivity.
Process and feeding flexibility
With the POWER VECTOR, this method is now being translated into a practice-oriented manufacturing system. The platform features an automatic tool changer, achieves bonding forces of up to 588 N, and works with all popular processes: dry paste, wet paste, and die transfer film (DTF). Components can be supplied via wafer, tape-and-reel, waffle pack, or tray.
The POWER VECTOR uses a hot thermo-compression bond head to place dies on the substrate with outstanding precision. To achieve this, the bond head and platform can be heated to >200°C to create a pre-adhesion, which is finished using ASMPT's SilverSAM sintering platform at temperatures between 200 and 300 degrees Celsius and pressures between 5 and 30 MPa.
“Silver sintering creates reliable and highly conductive connections even in applications with high currents where components become quite hot,” says David Felicetti. “With the POWER VECTOR system, we have closed one of the last remaining gaps in our portfolio and are now able to offer a full-service production line for power modules.”
Suggested Items
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial TeamGoogle announced that it has entered Taiwan’s first corporate geothermal power purchase agreement (PPA) with Baseload Capital to expand access to around-the-clock clean energy in the Asia-Pacific region and beyond.
PTCRB Certification Adds New IoT Chipset Certification Category, Certifies Sony's Altair ALT1350 CTIA Certification
04/23/2025 | PRNewswireCTIA Certification announced the first PTCRB certified IoT chipset, Sony's Altair ALT1350.
Flex Wins Two 2025 PACE Awards for Innovation in Automotive Compute and Power Electronics
04/22/2025 | PRNewswireFlex was named a two-time 2025 Automotive News PACE Award winner at the awards ceremony on April 15, recognized for its industry-leading Jupiter Compute Platform and Backup DC/DC Converter design platforms.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.