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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Whole Cloud Market in Asia/Pacific will Hit $329.1B in 2027
July 8, 2024 | IDCEstimated reading time: Less than a minute
According to a recent IDC report, Asia/Pacific Whole Clou d Forecast, 202 4 –202 7, the Asia/Pacific Whole Cloud spending is forecasted to grow at a CAGR of 17.3% and reach $329.1 billion by 2027. Asia/Pacific Whole Cloud spending grew at a year-over-year (YoY) rate of 10% in 2023, and IDC expects the market to grow at 23.4% in 2024 as cloud-related spending continues to accelerate.
"Despite last year’s economic challenges, there has been considerable demand for the cloud as it becomes the foundation for innovation and a key enabler for leveraging AI. We anticipate robust investments across hardware, software, professional, and managed services as organizations (including governments) in the region aim to scale their digital economies. A major focus will also be on cloud cost optimization with the outlook to maximize utilization of cloud resources,” says Shouvik Nag, Senior Research Analyst, Cloud Research, IDC Asia/Pacific.
Since the last decade, cloud technologies have enabled innovation at scale and speed. The last few years have seen a shift towards leveraging cloud as an operating model and delivery platform; it will continue to play a critical but increasingly supporting role in enabling a rapid pivot to the AI everywhere era.
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Simon Khesin - Schmoll MaschinenSuggested Items
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
CMMC Compliance and AI Integration with Accurate Circuit Engineering
04/23/2026 | Real Time with... APEX EXPOJames Hofer of Accurate Circuit Engineering (ACE) delves into the challenges and benefits of integrating AI and meeting stringent security requirements. Discover how ACE navigates CMMC, its impact on data management, and the strategic advantages of certification for businesses.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).