Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS
May 9, 2024 | EMA Design AutomationEstimated reading time: 1 minute
Experiencing challenges with MCAD/ECAD collaboration? Do update and revisions take too long? Are you finding integration issues too late in the design process? Does the fidelity of the ECAD data you receive prevent you from building a full digital prototype of your design before manufacture?
If you answered yes to any of these questions you are not alone. MCAD/ECAD is a significant challenge and pinch point in the overall design process and with increasing product complexity and compressed schedules the challenge is only getting more severe. Fortunately, Cadence & Dassault have partnered to help design teams solve these problems through enhanced integration between the MCAD and ECAD design software.
Learn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.
What You Will Learn:
- Common challenges in ECAD/MCAD collaboration and how to overcome them.
- How Cadence & Dassault have partnered to solve these challenges.
- Importance of native integration for MCAD design continuity
- How to effectively collaborate with ECAD on design choices and libraries
- Preview of next generation 3DX cloud connector
May 14th, 2024 @ 2:00pm ET. Register now in the events section of ema-eda.com.
Share on:
Suggested Items
indie Semiconductor Reports Q1 2025 Results
05/13/2025 | BUSINESS WIREindie Semiconductor, Inc., an automotive solutions innovator, today announced first quarter results for the period ended March 31, 2025. Q1 revenue was up 3.3 percent year-over-year to $54.1 million with Non-GAAP gross margin of 49.5 percent. On a GAAP basis, first quarter 2025 operating loss was $38.9 million compared to $49.6 million a year ago.
Siemens Leverages AI to Close Industry’s IC Verification Productivity Gap in New Questa One Smart Verification Solution
05/13/2025 | SiemensSiemens Digital Industries Software announced the Questa™ One smart verification software portfolio, combining connectivity, a data driven approach and scalability with AI to push the boundaries of the Integrated Circuit (IC) verification process and make engineering teams more productive.
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
05/13/2025 | Jesse Vaughan -- Column: Beyond the BoardThe electronics industry is at the heart of technological progress, driving innovative advancements that shape our world. Yet, despite the sector's rapid evolution, it faces a looming challenge: attracting and retaining young talent. With an aging workforce and an increasing demand for skilled professionals, the industry must find ways to inspire the next generation of innovators.
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.