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Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

Heilind Asia Pacific Awarded 2024 'Best Strategic Account Development' by TE Connectivity

11/25/2024 | GlobeNewswire
Heilind Asia Pacific is excited to share that it has received the 2024 Best Strategic Account Development Award from TE Connectivity, in recognition of the company's outstanding performance in driving business growth and strengthening strategic customer relationships.

iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

American Standard Circuits to Exhibit at the 2024 Annual Symposium of The Association of Old Crows

11/19/2024 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits/ASC Sunstone announced that his company will be exhibiting at the Annual Conference and Symposium of the Association of Old Crows to be held December 11 through the 13 in National Harbor, Maryland.

Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES

11/14/2024 | Boeing
Boeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.
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