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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Revolutionizing Soldering: Kurtz Ersa to Debut Cutting-Edge Lineup at APEX
March 12, 2024 | Kurtz ErsaEstimated reading time: 2 minutes
Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Attendees can visit Kurtz Ersa at Booth #2320, with additional machinery available for viewing in Booth 2620.
This year, Kurtz Ersa will debut several new products, making their first appearances in the Americas:
1. HOTFLOW THREE – Ersa Reflow Soldering Machine The Ersa HOTFLOW THREE, manufactured in Mexico starting in 2024, utilizes patented Ersa heating technology for optimal heat transfer with minimal energy and nitrogen consumption. Setting the industry standard for productivity to footprint ratio, this reflow soldering system offers double to quadruple transport options, enabling remarkable throughput increases without additional floor space. With up to four transport speeds and precisely adjusted transport widths, a wide variety of assemblies can be efficiently processed.
2. VERSAFIT 500 – Press-Fit Technology The Ersa VERSAFIT 500 is a highly flexible inline system designed to significantly enhance the competitiveness of press-fit technology in electronics production. This alternative connection technology reduces production costs and improves assembly quality. At its core is the servo-electric press cylinder, offering precise control and monitoring of force and travel.
3. VERSAFLOW ONE X-Series – Enhanced Selective Soldering Building on the success of the VERSAFLOW ONE, the X-Series introduces variability, optimizing throughput, economic efficiency, and soldering quality. This compact in-line selective soldering system features a dual-pot soldering module, providing exceptional flexibility and performance.
4. ERSA MK2 Soldering Stations The new ERSA MK2 line of soldering stations boasts the patented Tip’n’Turn concept for quick and secure tip exchanges, coupled with a remarkable performance increase of 20%. These stations, starting at 150 Watts, ensure optimum performance for manual applications. With advanced soldering tip technology, precise temperature control, and rapid heating and reheating capabilities, the MK2 series sets new standards for soldering stations.
In addition to these groundbreaking products, Kurtz Ersa will present its comprehensive range of equipment, including selective soldering, reflow soldering, wave soldering, stencil printers, rework systems, optical inspection devices, hand tools, and additive manufacturing solutions.
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Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.