-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Wearable Devices Teams up with Qualcomm to Elevate Extended Reality Experience
February 28, 2024 | Globe NewswireEstimated reading time: 1 minute
Wearable Devices Ltd. , a technology growth company specializing in artificial intelligence (“AI")-powered touchless sensing wearables, today announced a collaboration agreement with Qualcomm Technologies, Inc. This collaboration will help those looking to use Wearable Devices' innovative Mudra technology when developing products using the Qualcomm Snapdragon Spaces™ XR Developer Platform, redefining interaction in augmented reality (“AR”) and virtual reality (“VR”) environments.
The Mudra technology, known for its touchless control capabilities, has been optimized to work with Snapdragon Spaces, enhancing the user experience with intuitive, gesture-based interactions. This collaborative approach aims to showcase the innovative potential of combining Mudra's touchless control technology with Snapdragon Spaces, setting a new standard for immersive digital experiences.
"Partnering with Qualcomm Technologies marks a significant milestone in our journey to revolutionize the XR industry," said Offir Remez, Executive Vice President of Business Development at Wearable Devices. "The integration of our cutting-edge Mudra technology with Snapdragon Spaces is enhancing the XR experience and reimagining how we interact with digital worlds. Together, we're paving the way for a future where seamless, intuitive gestures bring us closer to technology, making immersive environments more accessible and engaging than ever before,” added Mr. Remez
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).