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The Shaughnessy Report: Solving the Data Package Puzzle

05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy Report
If you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.

AT&S Starts High Volume Manufacturing at New Plant in Kulim/Malaysia

05/06/2025 | AT&S
AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn Bhd is ready to start high volume manufacturing at the new campus at Kulim Hi-Tech Park (KHTP) in the state of Kedah. AT&S Malaysia delivers high-end Integrated Circuit (IC) Substrates for AMD’s data center processors and other customers.

Northrop Grumman’s IVEWS Completes F-16 Electronic Warfare Operational Assessment

05/05/2025 | Northrop Grumman
Northrop Grumman Corporation’s IVEWS (Integrated Viper Electronic Warfare Suite) has successfully completed Operational Assessment flight testing on U.S. Air Force F-16 aircraft, demonstrating its effectiveness against advanced radar-guided threats.

GEN3 Installs HATS²™ System with RAS Inc.’s Bob Neves, Launches Expanded Test Services at New Technical Centre

04/07/2025 | Gen3 Systems
In a significant step toward advancing our testing capabilities, we are excited to announce the successful installation of the state-of-the-art HATS²™ (Highly Accelerated Thermal Shock) system at our brand-new Technical Centre in Hampshire, England.

AT&S Kicking Off Global 'Health Month' Campaign

04/02/2025 | AT&S
As a globally leading technology company, AT&S attaches great importance not only to the high-tech competence of its employees, but also to a safe and healthy working environment and the well-being of its workforce.
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