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AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben

06/04/2025 | AT&S
AT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,

AT&S Strengthens European Research at IPCEI Day

05/26/2025 | AT&S
With the IPCEI program, the European Union supports companies that make important contributions to the technological development of key industries on the old continent.

CACI’s Mission-Critical Technology will Accelerate the Delivery of Electronic Warfighting Capabilities to the U.S. Navy’s Existing Fleet

05/13/2025 | CACI International Inc.
CACI International Inc  announced today that it has been awarded additional work by the U.S. Navy to procure enhancements to the current fielded Shipboard Information Warfare Exploit system under its existing contract for Spectral, a next-generation shipboard signals intelligence (SIGINT), electronic warfare (EW), and information operations (IO) weapon system.

Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing

05/14/2025 | Barry Matties, I-Connect007
Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meeting industry demands and addressing persistent challenges. One significant innovation is the High Acceleration Thermal Shock (HATS²) test system, which transforms how reliability testing is conducted. After 40 years in the testing business at Microtek, Bob Neves is beginning a new journey with his company, Reliability Assessment Solutions Inc. (RAS).

The Shaughnessy Report: Solving the Data Package Puzzle

05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy Report
If you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.
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