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NEC Develops 150 GHz Antenna-on-Chip Transmitter IC Chip for Beyond 5G/6G Radio Equipment
October 12, 2023 | JCN NewswireEstimated reading time: 1 minute
NEC Corporation has developed a 150 GHz transmitter IC chip and supporting technologies in preparation for Beyond 5G and 6G mobile access radio communication systems. According to an NEC survey, this is the first demonstration of preferred beam steering performance with 4-channel Antenna-on-Chip (AoC) IC technology using On the Air (OTA) radiation pattern measurement. Based on innovative RF circuit design technology, it has become possible to integrate 150 GHz phased array antenna elements, phase shifters and transmission amplifiers into a single chip. The 22-nm SOI-CMOS technology used for manufacturing this IC is cost effective, suitable for mass production, and has the ability to support large scale integration of digital, analog and RF functionalities in a chip. This allows for both higher frequencies and smaller sizes, which also contributes to lower Total Cost of Ownership (TCO) and potentially accelerates social implementation.
Beyond 5G and 6G are expected to provide 100 Gbps class broadband communications that are more than ten times faster than 5G. To achieve this, it is effective to utilize the sub-terahertz band (100GHz to 300GHz), which can secure a wide bandwidth of 10GHz or more. In particular, the D-band (130 GHz to 174.8 GHz), which is already assigned for fixed wireless communication systems worldwide, is expected to contribute to early social implementation. However, since the sub-terahertz band is subject to large propagation losses, large interconnection losses and device performance is near its limit, there is a need for the development of highly directional, high-gain antenna technology and its beam steering technology. To overcome these challenges, NEC developed a new IC chip that supports the 150GHz band. Going forward, NEC will continue to develop advanced technologies with the aim of contributing to the commercialization of 6G that is expected in the 2030s.
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The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
05/01/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.