Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Rehm Thermal Systems Strengthens Its Presence in Spain and Portugal: Propelec Appointed as New Representative

10/14/2026 | Rehm Thermal Systems
Rehm Thermal Systems is expanding its sales activities in the Spanish and Portuguese markets and has appointed Propelec S.L. as its new representative for the Protecto and RDS UV LED product ranges.

United Electronics Corporation Installs New Automated Pumice Surface Preparation Line

10/08/2026 | United Electronics Corporation
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask Adhesion

Microscreen, AGI Corporation Launch MAA, Expanding Capabilities for Both Companies

09/02/2026 | Microscreen
Microscreen and AGI Corporation have formed the Microscreen AGI Alliance (MAA). The alliance adds AGI’s PCB tooling and engineering capabilities to Microscreen’s offerings, while providing Microscreen’s nanocoating technology to AGI’s customers.

Rehm Thermal Systems at EFX 2026: Practical Expertise and Innovative Solutions for Electronics Manufacturing

08/05/2026 | Rehm Thermal Systems
Rehm Thermal Systems will provide answers to these and other key questions from October 6 to 8, 2026, at the inaugural EFX – Expo for Electronics Manufacturing in Stuttgart.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/17/2026 | Nolan Johnson, SMT007 Magazine
The Pentagon’s announcement on Tuesday that CMMC certification is being immediately suspended is the big news of the week. We’ve been covering the CMMC journey since the beginning, and we’ll stick with the story for the duration. If you’ve followed my list of must-reads, you know that I’m always interested in semiconductor news, and this week had a few good ones. I’ll mention them here, and urge you to read the entire stories: Apple adds to the recent Intel fab agreement by adding to its U.S.-based design and manufacturing agreement with Broadcom; Micron is investing $3 billion to the U.S. semiconductor ecosystem; and Intel announces a 5 billion euro investment in European infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in