-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
SIA Welcomes Secretary Raimondo’s Commitment to Swift, Effective Implementation of CHIPS and Science Act
February 24, 2023 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding U.S. Commerce Secretary Gina Raimondo’s remarks on implementation of the CHIPS and Science Act.
“Secretary Raimondo has been a tireless advocate for the CHIPS and Science Act, the historic new law that will reinvigorate chip production and innovation in America. Since the CHIPS Act was introduced, companies in the semiconductor ecosystem have announced new projects across America totaling hundreds of billions of dollars in private investments and supporting hundreds of thousands of new jobs. These new projects—combined with the new law’s critical investments in semiconductor research—will help strengthen America’s economy, national security, critical supply chains, and leadership in the semiconductor-driven technologies of today and tomorrow.
“As the Secretary highlighted today, we must now ensure the CHIPS Act is implemented efficiently, effectively, and expeditiously. We share her ambitious vision that CHIPS implementation provides an historic opportunity to ‘unite behind a shared objective … and think boldly and think big.’ We look forward to working with Secretary Raimondo and other leaders in the Administration to advance the CHIPS Act’s goals of strengthening our economy and national security and making our supply chains more resilient.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SEMI Europe Policy Forum 2026 in Brussels to Focus on Chips Act 2.0
04/16/2026 | SEMIThe SEMI Europe Policy Forum Brussels 2026 to be held on June 3 will bring together industry leaders, economists, policymakers, and technology experts to examine how geopolitical dynamics are transforming the global semiconductor landscape and to identify concrete pathways for reinforcing Europe’s leadership role.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
EdgeCortix Secures Investment from Axiro Semiconductor, MPower Partners for Edge AI
04/15/2026 | BUSINESS WIREEdgeCortix, a leading fabless semiconductor company specializing in energy-efficient AI processing at the edge, announced a new investment from Axiro Semiconductor Pvt. Ltd., a wholly owned subsidiary of CG Power and Industrial Solutions, and MPower Partners, a Japan-based global venture capital fund, building on the strong momentum of its previously oversubscribed funding round.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
SEMI Europe Policy Forum Brussels 2026 to Focus on Chips Act 2.0 in Shaping the Future of Europe's Semiconductor Industry
04/14/2026 | SEMIThe SEMI Europe Policy Forum Brussels 2026 to be held on June 3 will bring together industry leaders, economists, policymakers, and technology experts to examine how geopolitical dynamics are transforming the global semiconductor landscape and to identify concrete pathways for reinforcing Europe’s leadership role. Registration is open.