The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Trackwise Announces Board Changes
January 9, 2023 | TrackwiseEstimated reading time: 1 minute
The Board of Trackwise Designs plc, a leading manufacturer of specialist products using printed circuit technology, is pleased to confirm, following the General Meeting to approve the Fundraising, held on Friday 6 January 2023, the appointment of Andrew Lapping and Chris Pennison to the Board of the Company, as Non-Executive Chairman and Non-Executive Director respectively, with effect from 8:00 a.m. on 9 January 2023.
As announced on 14 December 2022, and included in the Circular to Shareholders dated 15 December 2022, in order to maintain Board numbers and also to control the cost base, Susan McErlain and Ian Griffiths will step down from the Board at the same time. Charles Cattaneo intends to step down from the Board at the end of January 2023. Given the forthcoming departure of Charles Cattaneo, the Company is commencing a recruitment process for an additional new non-executive director.
Andrew Lapping, incoming Chairman of Trackwise, commented: "Today marks a fresh start for the Group after a very tough recent period. I am delighted to take on the challenge of helping to lead Trackwise with my former Hyperdrive CEO Chris Pennison as we join the Trackwise Board. We bring industry experience to the Group with a track record of transitioning smart technology into a commercially viable and successful product. Prior to our participation in the Fundraising, Chris and I undertook significant referencing of the sales pipeline and the core technology. As a result, we believe there is significant potential for Trackwise and its IHT technology in the EV market. Whilst I recognise that the Fundraising has been difficult for existing shareholders, I would urge all to get behind us as we look to exploit the Company's world-class IP and production facilities. I want to close by reassuring all stakeholders that Trackwise has enormous potential but to realise its true value, we have to think and act smart in a very dynamic and rapidly expanding market."
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.