Global PCB Connections: The Future of HDI PCBs
The Shaughnessy Report: The Designer of Tomorrow
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
MacDermid Alpha Launches ALPHA HiTech AD13-9910B Ultra-Low Temperature Adhesive
August 11, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: Less than a minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates.
ALPHA HiTech AD13-9910B can be cured at temperatures as low as 60°C enabling excellent adhesion strength and a reduction in the defect rate on temperature sensitive parts. The product is suitable for plastic parts or substrates that are very sensitive to high temperature exposure and exhibits excellent adhesion strength on Stainless Steel (SUS), Nickel, PCBs and Liquid Crystal Polymer (LCP).
“ALPHA HiTech AD13-9910B ultra-low temperature adhesive is able to fast cure at very low temperatures, with excellent dispensing performance,” comments Jimmy Shu, Product Manager Adhesives and Encapsulants at MacDermid Alpha. “The product meets market reliability requirements such as adhesion strength in high temperatures and high humidity making it an excellent solution for camera module, optical and other applications that are very sensitive to high temperature exposure.”
For more information on ALPHA HiTech AD13-9910B and our range of ALPHA HiTech Low Temperature Adhesives please visit MacDermidAlpha.com.
Share on:
Suggested Items
Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025
01/16/2025 | Indium CorporationIndium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
SMTA Ontario Presents Webinar on Achieving Enhanced Reliability with a Novel Lead-Free, Bismuth-Free, Low-Temperature Solder
01/09/2025 | SMTAThe Ontario Chapter of the Surface Mount Technology Association (SMTA) invites electronics industry professionals to a technical webinar featuring Emily Belfield, Regional Sales Manager at Indium Corporation.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
PDR Offers Advanced Infrared Heating Technology for BGA Rework
12/02/2024 | PDRPDR Americas is proud to highlight its industry-leading solutions for BGA and SMT rework. As a trusted partner in electronics manufacturing, PDR’s rework stations deliver precision, reliability, and simplicity, setting a new standard for addressing the challenges of modern rework applications.
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.