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Summer Sale on Select Seika's McDry Dry Cabinets
June 15, 2022 | Seika Machinery, Inc.Estimated reading time: Less than a minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced its summer sale on select McDry models. The company has brought in many popular models to meet demand and is offering a discount for a limited time.
McDry cabinets are the first desiccant based drying systems especially built for electronics assemblers and introduced in the U.S. more than 30 years ago. All cabinets are the latest models with upgraded dehumidification speed and recovery to set point two to three times faster. Additionally, the desiccant automatically recycles and does not require replacement.
All McDry cabinets maintain a 1% RH level and conform to the IPC-JEDEC J-STD 033D and IPC-1602 as well as the ESD standard, IEC-61340-5-1. Models in stock or coming by July include: DXU-1001A, DXU-1002A, DXU-1002LA, MCU-340A, MCU-201A, MC-1002A, MB-1001A and MB-301A. Supplies limited and sale subject to availability.
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11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.