Target Condition: Distribution of Power—Denounce the Ounce
Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
I-Connect007 Editor’s Picks: Five Must-Reads for the Week
June 10, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.
Mike Carano Joins the Averatek Team as Vice President of Quality
Published June 3
As a former VI at RBP Chemical Technology, and Global R&D director at OM Group, as well as an influential advisor for IPC, I-Connect007 columnist Mike Carano brings a deep skillset to this new role with Averatek. Read the details here.
The Double-edged Sword of CMMC 2.0
Published June 6
MX2 Technology’s Divyash Patel updates readers on CMMC (Cybersecurity Maturity Model Certification) overall, and the upcoming version 2.0 criteria specifically. Given the likelihood that CMMC will touch most of us in the industry eventually, readers clearly wanted to know more.
Atotech Sells 1,000th Horizontal Electrolytic Copper Plater
Published June 8
Atotech announced the sale of its 1,000th installation of the Uniplate horizontal plating line to a Taiwan-based PCB manufacturer. The article also includes a timeline of milestones in the Uniplate line.
Isola Lays Groundwork for Faster, Higher-Frequency Circuits at 2022 IMS
Published June 7
If you’re visiting the 2022 IEEE International Microwave Symposium in Denver, Colorado, June 21-23, Isola will be present, discussing hybrid design and fabrication and dielectric constants in materials. Readership was high for this article; find the details inside.
Candor Nails the ROI With InduBond
Published June 7
Sunny Patel is engineering manager at Candor Industries. We follow up on Sunny Patel’s initial interview about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine.
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Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.